Abstract

      Conquering severe thermal bottlenecks in sealed, fanless enclosures requires a shift from traditional airflow to Cincon"s advanced conduction cooling technology.

The Sealed Enclosure Challenge

      Designing for sealed, fanless enclosures means facing one ultimate enemy: heat. Without airflow, standard power supplies may eventually overheat and fail.

At Cincon, we solve this with industry-leading Conduction Cooling—transferring heat directly through the baseplate to the chassis, eliminating mechanical fans, noise, and dust ingress.

Choosing Your Shield: CFM vs. LFM Series

Whether you need a robust standard design or a high-density flagship, we have you covered:

• Select CFM Series: Our reliable, high-performance conduction-cooled foundation for diverse industrial applications.
• LFM Series (Flagship): Engineered for extreme space constraints and next-gen integration. It features:
  • Ultra-Thin 1-Inch Profile: Built for compact systems.
  • Semi-Potted Design: The potting compound acts as an active thermal bridge, transferring heat far more efficiently than open-frame competitors.
  • Liquid-Cooling Ready: Engineered with a 1-inch low profile, baseplate-cooling design, and semi-potted structure, the LFM series mates seamlessly with liquid cold plates to deliver unrivaled thermal performance.

See the Tech in Action!

      Want to see the thermal imaging proof and explore our real-world case studies (including a 750W edge computing solution and a 151W substation design running fanless at 65°C )?

We’ve put together a comprehensive video breaking down our thermal architecture.

[Watch the Full Video on YouTube] https://youtu.be/fcI1WL9xwGg

Partner with Us for Your Next Design: sales@cincon.com

Explore Our Conduction Portfolio: Cincon Fanless Power Solutions ; Rugged 1 Inch Low Profile